An analysis about the competition pattern of Chinas integrated circuit packing industry in the year 2012
Integrated circuit package not only plays a role in an internal chip bonding and in external electrical connection ,but also provides a stable and reliable working environment for integrated circuit chip and a mechanical or environmental protection for integrated circuit chip.Thus the integrated circuit chip can function properly and ensure that it has high stability and reliability. In short, the packaging quality of integrated circuits has great influence on the overall performance of the integrated circuit. Therefore, the package shoud have strong mechanical performance, good electrical performance, heat resistance and chemical stability performance.
Although the ICs difference in physical structure, the application field and the number of I/O is very big, the difference in the role and function of the IC package is not so significant ,In addition,the purpose of packaging is prettty consistent.As the protector of the chip, package plays several roles. To sum up, there are two main fundamental roles .
(1) Protect the chip from physical damage;
(2) Redistribute I/O and obtain pin pitch more easily handled in assembly. Pacakge plays other minor roles such as providing a more easily standardized structure, providing cooling channel for the chip, protecting the chip from avoiding errors caused by soft particles and providing a more convenient structure for testing and aging test.
The package can also be used to interconnect multiple IC. It can directly make interconnection using standard wire bonding technology,or can also use interconnecting pathways provided by packaging, such as hybird packaging technology,multichip module,system level packaging , the borad system miniaturation and interconnection pathways included in interconnecting methods. WIth the development of microelectronic and laboratory device on chip, packaging plays a greater role, such as putting restrictions on the contact of the chip with the outside world, meeting the pressure requirements and requirements of the chemistry and atmosphere environment. People pay more and more attention and do research on packaging in order to meet the requirements of the continous development of the important area. Great changes have taken place in recent years in the importance and function of packaging. IC packaging has become a field as important as itself. This is because in many cases, the performance of IC is restricted by ICs package. Therefore, people pay more and more attention to the development of IC packaging technology to meet new challenges.
The competition pattern of packaging industry all over the world
Along with the growth and development of the integrated circuit industry,IC packaging industry and other industries have gone through the continous process of industrial transfer in the world. Integrated circuit packaging industry began in the nineteen sixties, is now transferrring from the developed countries in Europe and America to the countries in Asia Pacific region. At present, countries or regions mainly engaged in semiconductor packaging are Chinas Taiwan, mainland China, Singapore, Japan and the United States of America. Chinas Taiwan region made its fortune from the integrated circuit pacakge and occupies now a leading position in the global IC packaging industry. In the annual top 10 global packaging companies of the year 2010, Taiwan enterprises occupy 5 seats.
The competition pattern of the domestic packaging industry
As the electron- terminal -market s application value in Chinese domestic market is huge and fast growing,international semi-conductor manufacturers ,assembly and test foundry enterprises have moved their packaging production to China in order to reduce the production cost,directly stimulating the rapid expansion of Chinas semi-conductor packaging industry.
At present, the major global IDM manufacturers and professional packaging and testing plants have built up production base in mainland China, which resulted in foreign funded packaging and testing enterprises propertion being very high . At the same time, after many years efforts, packaging enterprises of Chinas domestic and domestic holdings enterprises have made rapid developments and are gradually narrowing the gaps with the international manufacturers in the technology and market. Part of the domestic packaging and testing companies such as ChangDian electronics technology ,TongFu micro electrical, HuaTian Technology etc have issued stocks in the domestic stock market.
